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Master Bond announced its EP30TC NASA low outgassing, thermally conductive epoxy designed for use in demanding thermal management applications.
This 2-part epoxy contains a robust thermally conductive filler with very fine particle sizes, and can be used for bonding, coating, sealing and encapsulating.
EP30TC exhibits a thermal conductivity of 18-20 BTU•in/ft2•hr•°F [2.60-2.88 W/(m•K)] and has the ability to be applied in sections as thin as 5-15 microns, resulting in a low thermal resistance of 7-10 x 10-6 K•m2/W.
This thermally conductive epoxy also is a reliable electrical insulator and has a volume resistivity of over 1014 ohm-cm. It is serviceable over the wide temperature range of -100°F to +300°F [-73°C to +149°C].
It exhibits low viscosity with excellent flow properties. As a two part system, it requires a 10 to 1 mix ratio by weight. Color coding facilitates mixing with Part A (gray) and Part B (clear). It can be cured at room or elevated temperatures, but to achieve optimum properties, the recommended cure schedule is overnight at ambient temperature followed by 2-3 hours at 150-200°F.
This system bonds well to metals, composites, ceramics, glass and many plastics. It has a tensile strength of 5,000-6,000 psi, a compressive strength of 24,000-26,000 psi and a tensile modulus of 500,000-550,000 psi. Dimensionally stable, the EP30TC thermally conductive epoxy has very low shrinkage upon curing and a low coefficient of thermal expansion.
Available in ½ pint, pint, quart, gallon and 5 gallon container kits, and in premixed and frozen syringes.
Master Bond Inc.
154 Hobart Street
Hackensack, NJ 07601-3922